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Empowering Global Hardware And System Innovation With Cutting-Edge Chip Solutions.
Contact UsFrom wafer-level probing to final product inspection, we deploy automated test equipment (ATE), scanning electron microscopy (SEM), and rigorous environmental stress testing (e.g., HTOL, TC). By simulating the harshest application scenarios, we use data-driven analysis to ensure every chip meets its design limits for performance, durability, and consistency.
This is our foundational commitment to reliability and your solid assurance for seamless market access worldwide.
Our team averages 15+ years in semiconductor design and application, with deep focus on key fields like AIoT, automotive electronics, and industrial control.
We implement a full-chain quality management system from architecture design to packaging & test, ensuring product lifecycle reliability.
We are more than a supplier; we are a joint-development partner, offering customized support from concept to volume production.
Our diversified and mature supply chain network ensures production flexibility and delivery security, helping you navigate market dynamics.
Our chip solutions have earned widespread deployment and recognition across global core markets, serving numerous industry leaders. Built on solid technological expertise and proven product reliability, we have consistently garnered authoritative industry accolades and maintained robust growth. These accomplishments are rooted in our total commitment to every client's trust.
This is our foundational commitment to reliability and your solid assurance for seamless market access worldwide.
From wafer-level probing to final product inspection, we deploy automated test equipment (ATE), scanning electron microscopy (SEM), and rigorous environmental stress testing (e.g., HTOL, TC). By simulating the harshest application scenarios, we use data-driven analysis to ensure every chip meets its design limits for performance, durability, and consistency.
Ensuring Source Quality of Materials & Wafers. We rigorously inspect all incoming raw materials, chemicals, and silicon wafers. Through visual inspection, dimensional measurement, and critical parameter testing against international standards and internal specifications, we eliminate defects at the source, laying a solid foundation for subsequent processes.
Screening Every Die Before Packaging. Prior to dicing, each die on the wafer is electrically tested using high-precision probe stations. This step quickly identifies and marks non-functional or out-of-spec chips, preventing defective units from entering costly packaging processes, thereby significantly improving overall yield and cost efficiency.
Comprehensive Functional & Performance Validation. After packaging, each chip undergoes thorough functional and parametric testing. Tests are conducted under various temperatures and voltages that simulate real-world conditions, ensuring every unit meets 100% of design specifications for all key parameters like speed, power consumption, and I/O interfaces. This is the core quality gate before shipment.
Simulating Harsh Environments to Predict Lifespan. Samples from each production lot undergo a series of accelerated environmental stress and lifespan tests, including HTOL, temperature cycling, and uHAST. These rigorous tests expose potential latent defects and evaluate long-term reliability and durability, providing data-backed assurance for stable operation in end applications.
Final Verification Before Dispatch. Before packaging and shipment, finished products undergo a final visual inspection, label verification, and batch documentation review. We ensure perfect packaging, correct identification, and complete traceability of all quality records. This is the final confirmation of our quality commitment prior to physical delivery to the customer.
Chip quality begins at the source. We enforce a stringent qualification process for all material and component suppliers, covering technical capability, quality systems, production stability, and social responsibility. We build strategic long-term partnerships and conduct ongoing performance monitoring with regular audits, ensuring every link in our supply chain resonates with our own quality standards.
View Our SuppliersOur team comprises seasoned engineers, scientists, and business experts from global semiconductor hubs. Diverse backgrounds bring broader innovative perspectives, while a shared belief—solving real-world problems with chip technology—unites us in close collaboration. We invest in continuous team development because we believe talent is the ultimate source of technological breakthrough.
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