Memory & Data Storage

H25G9TCXXCX702A is an SK hynix NAND Flash wafer product publicly listed as a 64GB / 512Gb NAND Flash V7 wafer. It is intended for high-capacity non-volatile storage applications after integration into managed storage products such as SSDs, eMMC/UFS devices, embedded storage modules, consumer electronics storage, industrial data storage, and custom NAND-based memory solutions. Because this part appears to be a wafer/die-level product rather than a standard packaged IC, technical parameters such as interface, voltage, ECC requirements, endurance, and package details should be confirmed directly with SK hynix or the supplier before procurement or design use.

H5AN8G8NCJR-XNC is an 8Gb DDR4 SDRAM memory chip manufactured by SK hynix. Featuring a 1G × 8 organization, 3200 MT/s data rate, and 1.2V low-power operation, it delivers high-speed and energy-efficient memory performance for servers, desktop computers, networking equipment, industrial systems, and embedded applications. With its FBGA-78 package and advanced DDR4 architecture, the H5AN8G8NCJR-XNC provides reliable, scalable, and cost-effective memory solutions for modern computing platforms.

H9TQ26ADFTACUR-KUM is a high-density eMCP memory solution from SK hynix that integrates 32GB eMMC 5.1 NAND Flash storage and 3GB LPDDR3 DRAM into a compact BGA221 package. Designed for smartphones, tablets, IoT devices, industrial embedded systems, and smart consumer electronics, it delivers excellent performance, low power consumption, and reduced PCB complexity. The H9TQ26ADFTACUR-KUM enables manufacturers to simplify system design while providing reliable storage and memory performance for modern embedded applications.