EP3SL200H780C3N [INTEL]

EP3SL200H780C3N Overview

There are two packages that contain fpga chips: 780-BBGA, FCBGA package and X package. Having 488 I/Os makes data transfers more coherent. Logic blocks consist of 200000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 0.86V~1.15V , at which it runs. The Stratix® III L series FPGA is a type of FPGA that belongs to the Stratix® III L family of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. There is an FPGA model contained in Tray in order to conserve space. A device like this one offers 10901504 RAM bits, which is a considerable amount of memory. In order to find related parts, use the part number EP3SL200 as a base. A total of 8000 LABs/CLBs make up this FPGA array. The device package supplied by 780-HBGA (33x33) is one of its suppliers.

EP3SL200H780C3N Features

488 I/Os
Up to 10901504 RAM bits

EP3SL200H780C3N Applications

There are a lot of Intel
EP3SL200H780C3N FPGAs applications.

• Computer hardware emulation
• Integrating multiple SPLDs
• Voice recognition
• Cryptography
• Filtering and communication encoding
• Aerospace and Defense
• Medical Electronics
• Audio
• Automotive
• Consumer Electronics