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    1. Home/
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    3. Integrated Circuits - ICs/
    4. Interface ICs/
    5. EPM2210F256A5 INTEL

    EPM2210F256A5 [INTEL]

    EPM2210F256A5
    EPM2210F256A5

    Part No:

    EPM2210F256A5

    Category:

    Interface ICs

    Manufacturer:

    INTEL

    Description:

    1.5/3.32.5/3.3V 1mm PMIC MAX® II Series EPM2210 256-BGA

    RoHS Status:

    Product FAQ

    1. Is EPM2210F256A5 available for RFQ?

    Yes. EPM2210F256A5 by INTEL is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.

    2. Why is there no fixed price for EPM2210F256A5?

    Pricing for EPM2210F256A5 can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.

    3. What are the key specifications of EPM2210F256A5?

    EPM2210F256A5 is a INTEL Interface ICs with Packaging: Tray and Time@Peak Reflow Temperature-Max (s): 30 and Moisture Sensitivity Level (MSL): 3 (168 Hours). Review the product details or submit an RFQ if you need confirmation before purchase.

    4. How fast can I get a quote for EPM2210F256A5?

    Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.

    5. How soon can EPM2210F256A5 be shipped?

    If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.

    6. Can you suggest alternatives to EPM2210F256A5?

    Yes. If EPM2210F256A5 is unavailable, obsolete, or does not meet your required lead time, we can help check similar INTEL Interface ICs parts or compatible alternatives.

    RFQ

    Part Number:

    EPM2210F256A5

    Manufacturer:

    INTEL

    Looking for Pricing? Contact us for volume pricing.

    IMPORTANT NOTICE

    Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

    Featured Product

    Datasheet:

    Stock Status:

    Available for RFQ

    Pricing:

    Request Volume Pricing

    Quote Response:

    Within 24 Hours

    Shipping:

    In-stock parts ship in 1–2 business days

    Specification

    Type
    Parameter
    Factory Lead Time
    8 Weeks
    Mounting Type
    Surface Mount
    Package / Case
    256-BGA
    Surface Mount
    YES
    Operating Temperature
    -40°C~125°C TJ
    Packaging
    Tray
    Series
    MAX® II
    JESD-609 Code
    e0
    Part Status
    Active
    Moisture Sensitivity Level (MSL)
    3 (168 Hours)
    Number of Terminations
    256
    ECCN Code
    3A001.A.7.A
    Terminal Finish
    TIN LEAD
    Additional Feature
    YES
    HTS Code
    8542.39.00.01
    Technology
    CMOS
    Terminal Position
    BOTTOM
    Terminal Form
    BALL
    Peak Reflow Temperature (Cel)
    220
    Terminal Pitch
    1mm
    Time@Peak Reflow Temperature-Max (s)
    30
    Base Part Number
    EPM2210
    JESD-30 Code
    S-PBGA-B256
    Qualification Status
    Not Qualified
    Power Supplies
    1.5/3.32.5/3.3V
    Programmable Type
    In System Programmable
    Number of I/O
    204
    Propagation Delay
    11.2 ns
    Number of Macro Cells
    1700
    JTAG BST
    YES
    Voltage Supply - Internal
    2.5V 3.3V
    Delay Time tpd(1) Max
    7ns
    Number of Logic Elements/Blocks
    2210
    RoHS Status
    RoHS Compliant

    Products Detail

    EPM2210F256A5 Overview


    Currently, there are 1700 macro cells, which are low-power cell sites (towers, antennas, masts) that serve as radio coverage.There is a 256-BGA package containing it.There are 204 I/Os on the board.Terminations of devices are set to 256.BOTTOM is the terminal position of this electrical part.There is a part in the family Programmable Logic Devices.It is recommended that the chip be packaged by Tray.The device operates at a temperature of -40°C~125°C TJ in order to ensure its reliability.Ideally, the chip should be mounted by Surface Mount.The MAX® II series FPGA is one of these types.If you use this device, you will also find YES.The EPM2210 can be used to identify its related parts.In total, there are 2210 logic elements/blocks.A power supply of 1.5/3.32.5/3.3V is required to operate it.

    EPM2210F256A5 Features


    256-BGA package
    204 I/Os
    The operating temperature of -40°C~125°C TJ
    1.5/3.32.5/3.3V power supplies


    EPM2210F256A5 Applications


    There are a lot of Intel
    EPM2210F256A5 CPLDs applications.


    • Bootloaders for FPGAs
    • Address decoders
    • Custom state machines
    • Digital systems
    • Portable digital devices
    • Handheld digital devices
    • Battery operated portable devices
    • Complex programmable logic devices
    • Digital designs
    • Field programmable gate

    Documents

    Datasheets:

    Max II Device HandbookMAX II FamilyMAX II Device Family Errata

    PCN Packaging:

    All Dev Pkg Chg 1/Aug/2018
    Shipping & Warranty

    Fast Dispatch: Ships in 5-7 days(in-stock parts within 1-2 days)

    Unishop Global Export: 1-7 days, $40.00

    Guaranteed Delivery: Door-to-door in 30 days

    Compliant Worldwide Shipping: DHL, FedEx, SF, and UPS.

    Feature

    • 30-Day Guarantee
      30-Day Guarantee
    • Fasted Delivery
      Fasted Delivery
    • Hassle-Free Returns
      Hassle-Free Returns
    • Secure payment method
      Secure payment method
    Mult Dev Dessicant Chg 19/Jul/2019
    Mult Dev Label CHG 24/Jan/2020
    Mult Dev Label Chgs 24/Feb/2020

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