1PMT4099CE3/TR7 [Microchip]

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

Surface mount equivalent to JEDEC registered 1N4099 thru 1N4135 and 1N4614 thru 1N4627 series except with additional power capability, Extensive selection from 1.8 to 100 V

Regulates voltage over a broad operating current and temperature range

Low noise density (1-3 kHz) at test current

Low reverse leakage current

RoHS compliant

Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively

Moisture classification Level 1 per IPC/JEDEC J-STD-020B with no dry pack required

Non sensitive to ESD per MIL-STD-750 Method 1020

Compatible with automatic insertion equipment

Full metallic bottom eliminates flux entrapment.