HV53011T-E/KVX [Microchip]

Name: HV53011T-E/KVX
Brand: Microchip
SKU: HV53011T-E/KVX

Part No:

HV53011T-E/KVX

Driver ICs

Manufacturer:

Microchip

Description:

16-Ch. +/- 135V Push-Pull Driver with RTZ and CS

Package:

-

RoHS Status:

-

Datasheet:

-

Production Status:

In Stock Status:

Specification

Type

Parameter

Type

Source-Sink

Output Channels

Vout Operating (V) - Transient

140

Vout Operating (V) - Sustained

135

Iout (mA) per Channel

Output Structure

Half-Bridge

Input Structure

SPI

Minimum Data Clock (MHz)

General Description

16-Ch ±135V Push Pull Driver w/RTZ, CS, and Boost for Haptic and Other Piezo Applications

Package

59-Ball 8 x 8 mm TFBGA Package

Products Detail

HV53011 is a high-voltage driver solution for surface haptic applications. It consists of 16 push-pull drivers capable of +/-135V output swing with Return-To-Zero (RTZ) function. Each output driver is capable of sourcing

and sinking at least 24 mA. Each high-voltage output is capable of driving up to 250 pF capacitive load. A global current sensor function is also integrated into this device to monitor the charge and discharge currents.

The measured current is mapped to a low voltage analog output with a scale factor of 3.1 V/V via a current sensing resistor.

An SPI interface is used to communicate between the microcontroller/processor and the high voltage drivers. This interface accepts 3.3V logic I/O signals up to clock speeds of 32 MHz. Five digital LATCH control signals manage the data flow and the firing pattern. It establishes the output to one of four possible states: VPP, VNN, 0V or high impedance.

A proper power on and off sequence is critical to ensure the operation of the high voltage driver. This driver requires four high voltage power rails, VPP, VPF, VNN, VNF, and three low voltage power rails, VCC, VSS

and VLL. A companion integrated driver IC, HV53001, has a built-in power on/off sequence control circuits to maintain the proper orders.

A shutdown function is available to disable the driver and set it to consume minimum power when the driver.

The HV53011 device is packaged in a 8 x 8 mm 59-ball TFBGA package. All high voltage I/O are assigned to have sufficient clearance for safety purpose.

Microchip has partnered with Tanvas to create this chipset that optimizes size and features for enabling surface haptic applications. Learn more >>

16-Channel Push-Pull Output w/Return-To-Zero (RTZ) and High Impedance (Hi-Z) Functions
Up to ±135V Output Voltage w/24 mA Minimum Source Sink Output Current (250pF Cload Max)
Current Sensor Output
SPI Interface with Quad-Latched (2-Bit/Channel) Architecture
Power-On Reset Function
Shutdown Function
59-Ball 8 x 8 mm TFBGA Package

Key Features

No key features available

Application scenarios

No application scenarios available

Documents

No documents available

RFQ

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Shipping & Warranty

Fast Dispatch: Ships in 5-7 days(in-stock parts within 1-2 days)

Unishop Global Export: 1-7 days, $40.00

Guaranteed Delivery: Door-to-door in 30 days

Compliant Worldwide Shipping: DHL, FedEx, SF, and UPS.

Feature

30-Day Guarantee
Fasted Delivery
Hassle-Free Returns
Secure payment method

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

The measured current is mapped to a low voltage analog output with a scale factor of 3.1 V/V via a current sensing resistor.

and VLL. A companion integrated driver IC, HV53001, has a built-in power on/off sequence control circuits to maintain the proper orders.

A shutdown function is available to disable the driver and set it to consume minimum power when the driver.

The HV53011 device is packaged in a 8 x 8 mm 59-ball TFBGA package. All high voltage I/O are assigned to have sufficient clearance for safety purpose.

Microchip has partnered with Tanvas to create this chipset that optimizes size and features for enabling surface haptic applications. Learn more >>

16-Channel Push-Pull Output w/Return-To-Zero (RTZ) and High Impedance (Hi-Z) Functions
Up to ±135V Output Voltage w/24 mA Minimum Source Sink Output Current (250pF Cload Max)
Current Sensor Output
SPI Interface with Quad-Latched (2-Bit/Channel) Architecture
Power-On Reset Function
Shutdown Function
59-Ball 8 x 8 mm TFBGA Package