MSMCG7.0CA [Microchip]

The SMCG gull-wing design in the DO-215AB package allows for visible solder connections. The SMCJ J-bend design in the DO-214AB package allows for greater PC board mounting density. Selections include unidirectional and bidirectional as well as RoHS compliant versions. These are available with a variety of upscreening options for enhanced reliability. They can protect against the secondary effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching environments and induced by RF radiation. Since their response time is virtually instantaneous, they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4. High reliability devices with fabrication and assembly lot traceability, 100% surge tested, 3σ lot norm screening performed on standby current (ID), available in both unidirectional and bidirectional versions, moisture classification Level 1, enhanced reliability screening options available in reference to MIL-PRF-19500, RoHS compliant versions available.