0736443007 [Molex]

Name: 0736443007
Brand: Molex
SKU: 0736443007
Availability: InStock

Part No:

0736443007

Backplane Connectors

Manufacturer:

Molex

Description:

High Density Metric (HDM) interconnect system for backplane and daughtercard stacking and midplane applications.

Datasheet:

Product FAQ

1. Is 0736443007 available for RFQ?

Yes. 0736443007 by Molex is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.

2. Why is there no fixed price for 0736443007?

Pricing for 0736443007 can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.

3. What are the key specifications of 0736443007?

0736443007 is a Molex Backplane Connectors with Compliant Pin Interface Resistance Max: 1 milliohm and Dielectric Withstanding Voltage Signal: 1500VAC. Review the product details or submit an RFQ if you need confirmation before purchase.

4. How fast can I get a quote for 0736443007?

Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.

5. How soon can 0736443007 be shipped?

If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.

6. Can you suggest alternatives to 0736443007?

Yes. If 0736443007 is unavailable, obsolete, or does not meet your required lead time, we can help check similar Molex Backplane Connectors parts or compatible alternatives.

RFQ

Part Number:

0736443007

Manufacturer:

Molex

Looking for Pricing? Contact us for volume pricing.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

The HDM backplane stacking and midplane interconnect systems consist of 6-row, 2mm grid modules providing 30 contacts per linear centimeter (over 75 per inch). Stacking connectors enable parallel board packaging with stack heights from 15mm to 32mm. Midplane backplane modules allow rear-side mating of cards. Both daughtercard receptacles and backplane headers are through-hole connectors with solder tail or eye-of-the-needle compliant pin terminals. Safety agency approvals include UL File E29179 and CSA File 152514 (LR19980).