0737804143 [Molex]

The HDM interconnect system provides high-density connections for backplane and daughtercard applications, supporting stacking configurations with heights from 15mm to 32mm and midplane mating. Modules feature through-hole connectors with solder tail or eye-of-the-needle compliant pin terminals. The system delivers robust electrical performance with signal contacts rated at 1A/250VAC and power contacts at 15A/500VAC, operating in temperatures from -55°C to 105°C.