0737822300 [Molex]

Name: 0737822300
Brand: Molex
SKU: 0737822300
Availability: InStock

Part No:

0737822300

Backplane Connectors

Manufacturer:

Molex

Description:

High Density Metric (HDM) interconnect system for backplane and daughtercard stacking and midplane applications, featuring 6-row 2mm grid modules with 30 contacts per linear centimeter.

Datasheet:

Product FAQ

1. Is 0737822300 available for RFQ?

Yes. 0737822300 by Molex is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.

2. Why is there no fixed price for 0737822300?

Pricing for 0737822300 can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.

3. What are the key specifications of 0737822300?

0737822300 is a Molex Backplane Connectors with Compliant Pin Interface Resistance Max: 1 milliohm and Insulation Resistance Initial Min: 5000 megohms. Review the product details or submit an RFQ if you need confirmation before purchase.

4. How fast can I get a quote for 0737822300?

Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.

5. How soon can 0737822300 be shipped?

If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.

6. Can you suggest alternatives to 0737822300?

Yes. If 0737822300 is unavailable, obsolete, or does not meet your required lead time, we can help check similar Molex Backplane Connectors parts or compatible alternatives.

RFQ

Part Number:

0737822300

Manufacturer:

Molex

Looking for Pricing? Contact us for volume pricing.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

The HDM interconnect system includes backplane and daughtercard modules for stacking and midplane configurations. It provides high-density interconnects with 6-row 2mm grid modules (30 contacts per linear centimeter). Stacking connectors support parallel board packaging with stack heights from 15mm to 32mm. Midplane modules allow rear-side mating of cards. Both daughtercard receptacles and backplane headers are through-hole connectors with solder tail or eye-of-the-needle compliant pin terminals. Safety agency approvals include UL File E29179 and CSA File 152514 (LR19980).