0739447201 [Molex]

Name: 0739447201
Brand: Molex
SKU: 0739447201
Availability: InStock

Part No:

0739447201

Backplane Connectors

Manufacturer:

Molex

Description:

High Density Metric (HDM) interconnect system for backplane and daughtercard, featuring 6-row 2mm grid modules with 30 contacts per linear centimeter.

Datasheet:

Product FAQ

1. Is 0739447201 available for RFQ?

Yes. 0739447201 by Molex is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.

2. Why is there no fixed price for 0739447201?

Pricing for 0739447201 can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.

3. What are the key specifications of 0739447201?

0739447201 is a Molex Backplane Connectors with Non Operating Temperature: -55°C ~ 85°C and Midplane Power Current: 11A. Review the product details or submit an RFQ if you need confirmation before purchase.

4. How fast can I get a quote for 0739447201?

Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.

5. How soon can 0739447201 be shipped?

If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.

6. Can you suggest alternatives to 0739447201?

Yes. If 0739447201 is unavailable, obsolete, or does not meet your required lead time, we can help check similar Molex Backplane Connectors parts or compatible alternatives.

RFQ

Part Number:

0739447201

Manufacturer:

Molex

Looking for Pricing? Contact us for volume pricing.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

The HDM interconnect system includes stacking and midplane modules for backplane and daughtercard connections. It provides high-density interconnects with 6-row 2mm grid modules (30 contacts per cm). Stacking connectors support parallel board packaging with stack heights from 15mm to 32mm. Midplane modules allow rear-side mating. Both daughtercard receptacles and backplane headers are through-hole connectors with solder tail or eye-of-the-needle compliant pin terminals. Safety agency approvals: UL E29179, CSA 152514 (LR19980).