Is XR2A0815 available for RFQ?

Yes. XR2A0815 by OMRON is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.

Why is there no fixed price for XR2A0815?

Pricing for XR2A0815 can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.

What are the key specifications of XR2A0815?

XR2A0815 is a OMRON IC & Component Sockets with Ic Lead Round Low Profile Dip: 0.50 dia. max. 0.41 dia. min. and Ic Lead Flat Low Profile Dip: 0.29 ±0.09 × 0.46 ±0.08. Review the product details or submit an RFQ if you need confirmation before purchase.

How fast can I get a quote for XR2A0815?

Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.

How soon can XR2A0815 be shipped?

If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.

Can you suggest alternatives to XR2A0815?

Yes. If XR2A0815 is unavailable, obsolete, or does not meet your required lead time, we can help check similar OMRON IC & Component Sockets parts or compatible alternatives.

XR2A0815 - OMRON | Electronic Components

Name: XR2A0815
Brand: OMRON
SKU: XR2A0815
Availability: InStock

Type

Parameter

Insulation Resistance

1,000MΩ min. (at 500 VDC)

Contact Resistance

20mΩ max. (at 20mV, 100mA max.)

Dielectric Strength

1,000 VAC for 1 min (leakage current: 1mA max.)

Rated Current

Operating Temperature

-55°C ~ 125°C

Base Material

Fiber-glass reinforced PBT resin (UL94V-0)/black

Carrier Material

Aluminum

Contact Insertion Force

3.92 N max.

Contact Removal Force

0.64 N min. with gold plating, 0.64 N min. with solder plating

Ic Lead Flat Dip

0.29 ±0.09 × 0.46 ±0.08

Ic Lead Flat Low Profile Dip

0.29 ±0.09 × 0.46 ±0.08

Ic Lead Round Dip

0.53 dia. max. 0.41 dia. min.

Ic Lead Round Low Profile Dip

0.50 dia. max. 0.41 dia. min.

Inner Clip Material

Beryllium copper/nickel base, gold plated

Insertion Durability

100 times (0.75-µm gold plating), 50 times (0.25-µm gold plating), 20 times (gold flash plating)

Outer Sleeve Material

Brass/nickel base, gold flash plating

Rated Voltage

300 VAC

Round pins and 4-point (4-finger) contact construction ensure long life and excellent shock and vibration durability. Contact entry holes are large for easy insertion. IC lead contacts placed high for solid connections. No flux rise. A wide product range: open-frame, closed-frame, single-row, carrier-type DIP terminals, wrap terminals, solder-sleeve terminals, and low-profile DIP terminals. A new tin-plated product series offers more choice when it comes to selecting the optimum IC Socket for an application. Conform to UL standards (file no. E 103202) and CSA standards (file no. LR 62678).

Round pins and 4-point (4-finger) contact construction
Large contact entry holes for easy insertion
IC lead contacts placed high for solid connections
No flux rise
Wide product range: open-frame, closed-frame, single-row, carrier-type DIP terminals, wrap terminals, solder-sleeve terminals, low-profile DIP terminals
Tin-plated product series
Conform to UL and CSA standards
Rated current: 1 A
Rated voltage: 300 VAC
Contact resistance: 20 mΩ max.
Insulation resistance: 1,000 MΩ min.
Dielectric strength: 1,000 VAC
Contact insertion force: 3.92 N max.
Contact removal force: 0.64 N min.
Insertion durability: 100 times (0.75-µm gold), 50 times (0.25-µm gold), 20 times (gold flash)
Operating temperature: -55 to 125°C