Is 74AC11257DBR available for RFQ?

Yes. 74AC11257DBR by Texas Instruments is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.

Why is there no fixed price for 74AC11257DBR?

Pricing for 74AC11257DBR can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.

What are the key specifications of 74AC11257DBR?

74AC11257DBR is a Texas Instruments Logic ICs with Operating Temperature: -40°C ~ 85°C and Thermal Impedance DB: 70°C/W. Review the product details or submit an RFQ if you need confirmation before purchase.

How fast can I get a quote for 74AC11257DBR?

Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.

How soon can 74AC11257DBR be shipped?

If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.

Can you suggest alternatives to 74AC11257DBR?

Yes. If 74AC11257DBR is unavailable, obsolete, or does not meet your required lead time, we can help check similar Texas Instruments Logic ICs parts or compatible alternatives.

74AC11257DBR - Texas Instruments | Electronic Components

Name: 74AC11257DBR
Brand: Texas Instruments
SKU: 74AC11257DBR
Availability: InStock

Type

Parameter

Supply Voltage

3V ~ 5.5V

Operating Temperature

-40°C ~ 85°C

Package

PDIP-N, SOIC-DW, SSOP-DB, TSSOP-PW

RoHS Status

RoHS Compliant

RoHS Status

RoHS Compliant

Packing

Tube; Tape and reel

Thermal Impedance DB

70°C/W

Thermal Impedance DW

58°C/W

Thermal Impedance N

60°C/W

Thermal Impedance PW

83°C/W

This device is designed to multiplex signals from 4-bit data sources to four output data lines in bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (OE) input is at a high logic level. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Features include flow-through architecture for optimized PCB layout, center-pin VCC/GND configurations to minimize switching noise, and 500-mA typical latch-up immunity.