Is CB052D0105J-- available for RFQ?

Yes. CB052D0105J-- by AVX is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.

Why is there no fixed price for CB052D0105J--?

Pricing for CB052D0105J-- can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.

How fast can I get a quote for CB052D0105J--?

Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.

How soon can CB052D0105J-- be shipped?

If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.

Can you suggest alternatives to CB052D0105J--?

Yes. If CB052D0105J-- is unavailable, obsolete, or does not meet your required lead time, we can help check similar AVX Capacitors parts or compatible alternatives.

CB052D0105J-- - AVX | Electronic Components

Name: CB052D0105J--
Brand: AVX
SKU: CB052D0105J--
Availability: InStock

3. What are the key specifications of CB052D0105J--?

CB052D0105J-- is a AVX Capacitors with Insulation Resistance Min C>0.33μF: IR C > 400 sec at 20°C for 1 min. charge at 10Vdc for VR<100Vdc and 100Vdc for VR≥100Vdc and Insulation Resistance Min C≤0.33μF: > 1000MΩ at 20°C for 1 min. charge at 10Vdc for VR<100Vdc and 100Vdc for VR≥100Vdc. Review the product details or submit an RFQ if you need confirmation before purchase.

General purpose film chip capacitors featuring metallized High Temperature PET dielectric in a naked stacked construction. Suitable for IR or vapor phase reflow processes without specific encapsulation. Offers excellent compatibility with all PCB materials due to intrinsic dielectric film elasticity. Self-healing property ensures safety open failure mode and enhanced reliability. Excellent thermal shock resistance. Low dissipation factor ESR & ESL, no piezoelectric effect, and non-polar construction. Available in tape and reel for automatic placement.

Key Features

IR or vapor phase reflow compatible, No encapsulation, Excellent PCB material compatibility, Self-healing property, Excellent thermal shock resistance, Low dissipation factor ESR & ESL, No piezoelectric effect, Tape and reel packaging, Non-polar construction

Application scenarios