Is XCZU5EV-3FBVB900E available for RFQ?

Yes. XCZU5EV-3FBVB900E by Xilinx is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.

Why is there no fixed price for XCZU5EV-3FBVB900E?

Pricing for XCZU5EV-3FBVB900E can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.

What are the key specifications of XCZU5EV-3FBVB900E?

XCZU5EV-3FBVB900E is a Xilinx Systems on a Chip - SoC with Packaging: Tray and Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED and Moisture Sensitivity Level (MSL): 4 (72 Hours). Review the product details or submit an RFQ if you need confirmation before purchase.

How fast can I get a quote for XCZU5EV-3FBVB900E?

Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.

How soon can XCZU5EV-3FBVB900E be shipped?

If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.

Can you suggest alternatives to XCZU5EV-3FBVB900E?

Yes. If XCZU5EV-3FBVB900E is unavailable, obsolete, or does not meet your required lead time, we can help check similar Xilinx Systems on a Chip - SoC parts or compatible alternatives.

XCZU5EV-3FBVB900E - Xilinx | Electronic Components

Name: XCZU5EV-3FBVB900E
Brand: Xilinx
SKU: XCZU5EV-3FBVB900E
Availability: InStock

This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s).

Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+? MPSoC EV series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+? FPGA, 256K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 204 I/Os.