The ST4SIM-200M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all industrial devices.

It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.

The device can manage different MNO profiles while ensuring the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).

The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).

The device provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP, 3GPP2 specifications.

The device integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory.

The device is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm SecurCore SC300 RISC core.

• • Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
  • Bootstrap connectivity profile provided by a trusted partner
  • Up to 7 connectivity profiles (depending on memory size)
  • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
  • Network access applications supported: SIM / USIM / ISIM / CSIM
  • Secure element access control (ARF / PKCS#15)
  • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
  • Multi-interfaces able to combine eSIM + eSE
• Hardware
  • Product available on ST33G1M2M
  • ST33 product based on a 32-bit Arm^® SecurCore^® SC300^™ RISC core
  • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
  • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
  • Serial peripheral interface (SPI), depending on packages
  • Industrial qualification (JEDEC JESD47)
  • Operating temperature: -40°C to +105°C
  • Common Criteria EAL5+
• ECOPACK-compliant packages
  • 2FF, 3FF or 4FF plugin card (based on D16 micromodule)
  • VFDFPN8 5 × 6 mm, wettable flank (MFF2)
  • WLCSP11
• Security
  • Symmetric cryptography DES / 3DES / AES
  • Asymmetric cryptography RSA (up to 2048 bits)
  • HTTPS remote management TLS v1.0, v1.1 and v1.2
  • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
  • Authentication algorithm: MILENAGE, TUAK, CAVE
• Software standard compliance
  • GSMA SGP.02 v3.2
  • SIMalliance interoperable profile v2.1
  • Java^® Card v3.0.4 Classic
  • GlobalPlatform^® card specification v2.2, including GP amendments A, B, C, D and E
  • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office)
  • Power saving features (PSM and eDRX) defined by ETSI release 13
• Certification
  • GlobalPlatform^®-certified Muse eUICC-i2 v1 compliant with GSMA SGP.02 v3.2