
3M, a capital manufacturer of wire-to-board, board-to-board, backplane and input / output application interconnection solutions, provides innovative solutions for the electronics industry. And these are some of the main solutions: Mini Delta Ribbon (MDR) I/O system, Mini-Clamp Discrete Wire System, 3M™ Wiremount Insulation displacement contact (IDC) connectors, new Ultra Hard Metric (UHM) backplane connectors and MetPak™ High Speed Hard Metric (HSHM) . Using industry-leading CAD features such as NX™ modeling and SLA modeling, 3M experienced engineers translate ideas into real-world solutions. 3M provides solutions for printed circuit board manufacturing, circuit board assembly and testing, such as adhesives and tapes, embedded capacitor materials, Textool™ test and aging sockets, carriers and cover bands and trays, flexible circuits, and products to ease electrostatic discharge. 3M also provides solutions in EMI/RFI shielding, thermal interface management and vibration reduction as well as packaging and labeling. test
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