Thermal management materials from Henkel's BERGQUIST® brand provide a wide range of solutions for improving the dependability of heat dissipation in modern electronic equipment. Gap filling thermal interface materials (TIMs) from BERGQUIST GAP PAD® are soft, compliant, pre-cut pads that decrease assembly stress while offering good thermal conductivity. Automatically applied liquid BERGQUIST Gap Filler TIMs are ideal for applications demanding complex dimensionsand/or high throughput. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).SIL PAD® Thermoconducting Insulators, BOND PLY® Thermal Adhesives, HI FLOW® Materials for Change of Phases and TCLAD® Insulated Metal Substrates (IMS®) are also part of the expandsive range of thermal solutions.
