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10AS048H2F34E1SG - INTEL | Electronic Components

Name: 10AS048H2F34E1SG
Brand: INTEL
SKU: 10AS048H2F34E1SG
Availability: InStock

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3. What are the key specifications of 10AS048H2F34E1SG?

10AS048H2F34E1SG is a INTEL Systems on a Chip - SoC with Operating Temperature Max Industrial: 100°C and Operating Temperature Min Industrial: -40°C. Review the product details or submit an RFQ if you need confirmation before purchase.

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Part No:

10AS048H2F34E1SG

Systems on a Chip - SoC

Manufacturer:

INTEL

Description:

The Intel® Arria® 10 device family consists of high-performance and power-efficient 20 nm mid-range FPGAs and SoCs, delivering higher performance and power efficiency than previous generations.

RoHS Status:

Datasheet:

Stock Status:

Available for RFQ

Pricing:

Request Volume Pricing

Quote Response:

Within 24 Hours

Shipping:

In-stock parts ship in 1–2 business days

Specification

Type

Parameter

Core Voltage

0.82V

Process Technology

20 nm

RoHS Status

Non-RoHS Compliant

Backplane Capability

12.5 Gbps

Operating Temperature Max Industrial

100°C

Operating Temperature Max Military

125°C

Operating Temperature Min Industrial

-40°C

Operating Temperature Min Military

-55°C

Package Options

Fineline BGA (1.0 mm ball pitch), Ultra Fineline BGA (0.8 mm ball pitch)

RoHS Status

RoHS Compliant

Transceiver Speed Gt Max

Products Detail

Intel Arria 10 devices are built on TSMC's 20 nm process technology and feature an enhanced 8-input adaptive logic module (ALM), variable-precision DSP blocks, embedded memory (M20K and MLAB), high-speed transceivers (up to 25.8 Gbps), hard memory controllers (DDR4, DDR3, DDR3L), and hard IP blocks for PCI Express Gen3. They are available in three variants: GX (17.4 Gbps transceivers), GT (25.8 Gbps transceivers), and SX (integrating ARM Cortex-A9 HPS). The devices offer advanced power savings, with up to 40% lower power compared to previous generation mid-range FPGAs and up to 60% lower power compared to high-end FPGAs.

Key Features

Technology: TSMC 20-nm process
Packaging: 1.0 mm and 0.8 mm ball-pitch BGA
FPGA Fabric: Enhanced 8-input ALM, improved routing, hierarchical core clocking, fine-grained partial reconfiguration
Internal Memory: M20K (20-Kb) with ECC, MLAB (640-bit)
Embedded Hard IP: Variable-precision DSP blocks (supporting floating point), Memory controllers (DDR4, DDR3, DDR3L), PCI Express Gen1/2/3, Transceiver I/O (10GBASE-KR/40GBASE-KR4 FEC, 10GbE, PCIe, Interlaken, etc.), Low-power serial transceivers (1 Gbps to 25.8 Gbps), HPS (for SX devices: dual-core ARM Cortex-A9, up to 1.5 GHz)
Configuration: Enhanced 256-bit AES security, Configuration via Protocol (CvP)
Power Management: SmartVID, low static power options, programmable power technology.