
MX25L12835FMI-10G/TR
MACRONIX
The LPC1766FBD100 is an embedded microcontroller for ARM Cortex-M3 applications that has a high level of integration and uses little power. A next-generation core, the ARM provides system improvements such improved debug tools and deeper support block integration. Up to 80 MHz of CPU frequency are supported by the LPC1766. The ARM Cortex-M3 CPU uses a Harvard architecture with a three-stage pipeline, independent local instruction and data buses, and a third bus for peripherals. Additionally, the inbuilt prefetch unit of the ARM Cortex-M3 CPU allows speculative branching. The LPC1766's peripheral complement consists of 4 UARTs, 2 CAN channels, 8-channel general-purpose DMA controller, Ethernet MAC, USB Device/Host/OTG interface, and kB of flash memory and kB of data memory. Two SSP controllers, three I2C interfaces, two inputs and two outputs on an I2S interface, an 8-channel 12-bit ADC, a 10-bit DAC, motor control PWM, a quadrature encoder interface, four general-purpose timers, six general-purpose outputs, an ultra-low power RTC with a separate battery supply, and up to 70 general-purpose I/O pins are all included. The ARM7-based LPC2366 microcontroller and the LPC1766 have pin compatibility.
There is a Memory Protection Unit (MPU) with support for eight regions. ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC) (NVIC). 256 kB of on-chip flash memory for programming. A better flash memory accelerator enables 80 MHz operating at high speed with no wait states. Using the on-chip boot loader software, in-system programming (ISP) and in-application programming (IAP) are possible. SRAM on the CPU with a local code/data channel for high-performance CPU access is included in the 64 kB on-chip SRAM. Two 16 kB SRAM blocks with distinct access pathways for improved throughput. Along with serving as general-purpose CPU instruction and data storage, these SRAM blocks can also be used as Ethernet, USB, and DMA memory.
Package: QFP100
RoHS: Lead free / RoHS Compliant
Industrial
Personal electronics
Communications equipment
Yes. LPC1766FBD100 by NXP is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.
Pricing for LPC1766FBD100 can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.
LPC1766FBD100 is a NXP Microcontrollers - MCU with Time@Peak Reflow Temperature-Max (s): 30 and Moisture Sensitivity Level (MSL): 3 (168 Hours). Review the product details or submit an RFQ if you need confirmation before purchase.
Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.
If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.
Yes. If LPC1766FBD100 is unavailable, obsolete, or does not meet your required lead time, we can help check similar NXP Microcontrollers - MCU parts or compatible alternatives.
Looking for Pricing? Contact us for volume pricing.
Fast Dispatch: Ships in 5-7 days(in-stock parts within 1-2 days)
Unishop Global Export: 1-7 days, $40.00
Guaranteed Delivery: Door-to-door in 30 days
Compliant Worldwide Shipping: DHL, FedEx, SF, and UPS.
IMPORTANT NOTICE
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

MX25L12835FMI-10G/TR
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