IRF510STRLPBF [Vishay]

Third generation power MOSFETs from Vishay provide the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. Suitable for high current applications due to low internal connection resistance, it can dissipate up to 2.0 W in typical surface mount applications. Features include surface mount capability, availability in tape and reel packaging, dynamic dV/dt rating, repetitive avalanche rating, 175°C operating temperature, fast switching, and ease of paralleling.