Разъемы для микросхем и компонентов

AUGAT* HOLTITE* Sockets are designed to be press-fit into a plated through hole of a printed circuit board, allowing the plated through hole to become a component socket.

This specification covers performance, tests and quality requirements for the TE Connectivity (TE) AUGAT* HOLTITE* Sockets. These sockets are designed to be press-fit into a plated through hole of a printed circuit board.

PLCC socket with 44 positions

(6-1415035-1) RT78726

Разъем DIP-сокет SKT 40 позиций 2.54 мм Пайка ST Thru-Hole Трубка

Low profile DIMM 2P socket with 168 positions for DRAM modules, 3.3V.

8-position DIP socket for through-hole mounting with right angle/horizontal orientation.

Socket Length 7.32 mm [.288 in], PCB Hole Diameter 2.56 mm [.101 in], Closed Bottom, .823 – 1.04 mm² Wire Size, 18 – 17 AWG Wire Size, Pin Sockets

A 28-pin DIP socket with surface mount and vertical mounting style.

Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs.

Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs.

Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs.

Small Outline (SO), Stack Height 5.6 mm [.22 in], Right Angle Module Orientation, 144 Position, AMP-METRIMATE, SO DIMM Sockets

DIP socket with surface mount termination, 2.54 mm centerline, and 40 positions.

DIP sockets with 6 to 48 contacts provide reliable connection between IC devices and PCBs. Termination options include through hole and surface mounting, four-finger and dual leaf contacts, and various plating options.

PGA socket with 223 positions, very low insertion force, and thru-hole PCB mount style.

Open frame PGA socket with 132 positions and 14x14 grid size.

Very low insertion force PGA socket with 114 positions, thru-hole PCB mount, and 13x13 grid spacing of 2.54 mm.

Surface mount LGA socket for Intel Core i7 LGA 1156 processors with integrated lever mechanism (ILM) and bolster plate.

Surface mount LGA socket for Intel® Core™ i7 LGA 1156 processor with integrated lever mechanism (ILM) and robust bolster plate.

Restriction of Hazardous Substances (RoHS 2)

Catalog for MTA, CST-100 II, SL-156 and AMP Economy Power (EP) connectors, designed to assist in identifying products for printed circuit board headers, mass termination connectors, and card edge connectors.

Catalog of MTA, CST-100 II, SL-156 and AMP Economy Power (EP) Connectors for printed circuit board applications.

DIPLOMATE DL low-profile DIP sockets for dual in-line package integrated circuits, available in 6 to 64 positions.