Доступен ли AM6254BTGFHIALWRQ1 для RFQ?

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Да. Если AM6254BTGFHIALWRQ1 недоступен, снят с производства или не подходит по срокам поставки, мы поможем проверить похожие позиции Texas Instruments в категории Процессоры - специализированные приложения или совместимые альтернативы.

AM6254BTGFHIALWRQ1 - Texas Instruments | Электронные компоненты

Name: AM6254BTGFHIALWRQ1
Brand: Texas Instruments
SKU: AM6254BTGFHIALWRQ1

2. Почему для AM6254BTGFHIALWRQ1 нет фиксированной цены?

Цена на AM6254BTGFHIALWRQ1 может зависеть от количества заказа, доступности на рынке, date code, упаковки и страны доставки. Запросите предложение, чтобы получить актуальную оптовую цену.

3. Какие ключевые характеристики у AM6254BTGFHIALWRQ1?

AM6254BTGFHIALWRQ1 — это Процессоры - специализированные приложения Texas Instruments с такими характеристиками: Operating temperature range (°C): -40 to 125 и TI functional safety category: Functional Safety-Compliant. Ознакомьтесь с деталями продукта или отправьте RFQ, если нужна проверка перед покупкой.

4. Как быстро я получу предложение по AM6254BTGFHIALWRQ1?

Наша команда продаж обычно отвечает в течение 24 часов после получения RFQ. Предложение может включать статус наличия, цену за единицу, срок поставки, варианты доставки и доступные альтернативы.

5. Как скоро можно отправить AM6254BTGFHIALWRQ1?

Если наличие подтверждено, товары со склада обычно могут быть отправлены в течение 1–2 рабочих дней. Итоговый срок зависит от количества, источника склада и страны доставки.

The low-cost AM62x Sitara™ MPU family of application processors are built for Linux® application development. With scalable Arm® Cortex®-A53 performance and embedded features, such as dual-display support and 3D graphics acceleration, along with an extensive set of peripherals, making the AM62x device well-suited for a broad range of industrial and automotive applications while offering intelligent features and optimized power architecture.

Functional safety requirements can be addressed using the integrated Cortex-M4F cores and dedicated peripherals, which can all be isolated from the rest of the AM62x processor.

The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking (TSN) capable. An additional PRU module on the device enables real-time I/O capability for customer’s own use cases. In addition, the extensive set of peripherals included in AM62x enable system-level connectivity, such as USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. The AM62x device also supports secure boot for IP protection with the built-in Hardware Security Module (HSM) and employs advanced power management support for portable and power-sensitive applications.

Products in the AM62x processor family:

AM625 – Human-machine Interaction SoC with Arm® Cortex®-A53-based edge AI and full-HD dual-display
AM625-Q1 – Automotive Display SoC with embedded safety for digital clusters
AM623 – Internet of Things (IoT) and Gateway SoC with Arm® Cortex®-A53-based object and gesture recognition
AM620-Q1 – Automotive Compute SoC with embedded safety for driver monitoring, networking and V2X systems

Processor Cores:

Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4GHz
- Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
- Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
Single-core Arm® Cortex®-M4F MCU at up to 400MHz
- 256KB SRAM with SECDED ECC
Dedicated Device/Power Manager

Multimedia:

Display subsystem
- Dual display support
- 1920x1080 @ 60fps for each display
- 1x 2048x1080 + 1x 1280x720
- Up to 165MHz pixel clock support with Independent PLL for each display
- OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB LVCMOS)
- Support safety feature such as freeze frame detection and MISR data check
3D Graphics Processing Unit
- 1 pixel per clock or higher
- Fillrate greater than 500Mpixels/sec
- >500MTexels/s, >8GFLOPs
- Supports at least 2 composition layers
- Supports up to 2048x1080 @60fps
- Supports ARGB32, RGB565 and YUV formats
- 2D graphics capable
- OpenGL ES 3.1, Vulkan 1.2
One Camera Serial interface (CSI-Rx) - 4 Lane with DPHY
- MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
- Support for 1,2,3 or 4 data lane mode up to 1.5Gbps per lane
- ECC verification/correction with CRC check + ECC on RAM
- Virtual Channel support (up to 16)
- Ability to write stream data directly to DDR via DMA

Memory Subsystem:

Up to 816KB of On-chip RAM
- 64KB of On-chip RAM (OCSRAM) with SECDED ECC , Can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
- 256KB of On-chip RAM with SECDED ECC in SMS Subsystem
- 176KB of On-chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
- 256KB of On-chip RAM with SECDED ECC in Cortex-M4F MCU subsystem
- 64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
DDR Subsystem (DDRSS)
- Supports LPDDR4, DDR4 memory types
- 16-Bit data bus with inline ECC
- Supports speeds up to 1600MT/s
- Max addressable range
  - 8GBytes with DDR4
  - 4GBytes with LPDDR4

Functional Safety:

Functional Safety-Compliant targeted [Automotive]
- Developed for functional safety applications
- Documentation will be available to aid ISO 26262 functional safety system design
- Systematic capability up to ASIL D targeted
- Hardware integrity up to ASIL B targeted
- Safety-related certification
  - ISO 26262 by TUV SUD planned
AEC - Q100 qualified

Security:

Secure boot supported
- Hardware-enforced Root-of-Trust (RoT)
- Support to switch RoT via backup key
- Support for takeover protection, IP protection, and anti-roll back protection
Trusted Execution Environment (TEE) supported
- Arm TrustZone based TEE
- Extensive firewall support for isolation
- Secure watchdog/timer/IPC
- Secure storage support
- Replay Protected Memory Block (RPMB) support
Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
Cryptographic acceleration supported
- Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
  - Supports cryptographic cores
- AES – 128-/192-/256-Bit key sizes
- SHA2 – 224-/256-/384-/512-Bit key sizes
- DRBG with true random number generator
- PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
Debugging security
- Secure software controlled debug access
- Security aware debugging

PRU Subsystem:

Dual-core Programmable Real-Time Unit Subystem (PRUSS) running up to 333MHz
Intended for driving GPIO for cycle accurate protocols such as additional:
- General Purpose Input/Output (GPIO)
- UARTs
- I2C
- External ADC
16KByte program memory per PRU with SECDED ECC
8KB data memory per PRU with SECDED ECC
32KB general purpose memory with SECDED ECC
CRC32/16 HW accelerator
Scratch PAD memory with 3 banks of 30 x 32-bit registers
1 Industrial 64-bit timer with 9 capture and 16 compare events, along with slow and fast compensation
1 interrupt controller (INTC), minimum of 64 input events supported

High-Speed Interfaces:

Integrated Ethernet switch supporting (total 2 external ports)
- RMII(10/100) or RGMII (10/100/1000)
- IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
- Clause 45 MDIO PHY management
- Packet Classifier based on ALE engine with 512 classifiers
- Priority based flow control
- Time sensitive networking (TSN) support
- Four CPU H/W interrupt Pacing
- IP/UDP/TCP checksum offload in hardware
Two USB2.0 Ports
- Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
- Integrated USB VBUS detection

General Connectivity:

9x Universal Asynchronous Receiver-Transmitters (UART)
5x Serial Peripheral Interface (SPI) controllers
6x Inter-Integrated Circuit (I2C) ports
3x Multichannel Audio Serial Ports (McASP)
- Transmit and Receive Clocks up to 50MHz
- Up to 4/6/16 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
- Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
- Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
- FIFO Buffers for Transmit and Receive (256 Bytes)
- Support for audio reference output clock
3x enhanced PWM modules (ePWM)
3x enhanced Quadrature Encoder Pulse modules (eQEP)
3x enhanced Capture modules (eCAP)
General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
3x Controller Area Network (CAN) modules with CAN-FD support
- Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
- Full CAN FD support (up to 64 data bytes)
- Parity/ECC check for Message RAM
- Speed up to 8Mbps

Media and Data Storage:

3x Multi-Media Card/Secure Digital (MMC/SD/SDIO) interface
- 1x 8-bit eMMC interface up to HS200 speed
- 2x 4-bit SD/SDIO interface up to UHS-I
- Compliant with eMMC 5.1, SD 3.0 and SDIO Version 3.0
1× General-Purpose Memory Controller (GPMC) up to 133MHz
- Flexible 8- and 16-Bit Asynchronous Memory Interface With up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
- Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
- Uses Hamming Code to Support 1-Bit ECC
- Error Locator Module (ELM)
  - Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm
  - Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms
OSPI/QSPI with DDR / SDR support
- Support for Serial NAND and Serial NOR flash devices
- 4GBytes memory address support
- XIP mode with optional on-the-fly encryption

Power Management:

Low power modes supported by Device/Power Manager
- Partial IO support for CAN/GPIO/UART wakeup
- DeepSleep
- MCU Only
- Standby
- Dynamic frequency scaling for Cortex-A53

Optimal Power Management Solution:

Recommended TPS65219 Power Management ICs (PMIC)
- Companion PMIC specially designed to meet device power supply requirements
- Flexible mapping and factory programmed configurations to support different use cases

Boot Options:

UART
I2C EEPROM
OSPI/QSPI Flash
GPMC NOR/NAND Flash
Serial NAND Flash
SD Card
eMMC
USB (host) boot from Mass Storage device
USB (device) boot from external host (DFU mode)
Ethernet

Technology / Package:

16nm technology
13mm x 13mm, 0.5mm pitch, 425-pin FCCSP BGA (ALW)
17.2mm x 17.2mm, 0.8mm pitch, 441-pin FCBGA (AMC)

1. Доступен ли AM6254BTGFHIALWRQ1 для RFQ?

2. Почему для AM6254BTGFHIALWRQ1 нет фиксированной цены?

3. Какие ключевые характеристики у AM6254BTGFHIALWRQ1?

4. Как быстро я получу предложение по AM6254BTGFHIALWRQ1?

5. Как скоро можно отправить AM6254BTGFHIALWRQ1?

1. Доступен ли AM6254BTGFHIALWRQ1 для RFQ?

2. Почему для AM6254BTGFHIALWRQ1 нет фиксированной цены?

3. Какие ключевые характеристики у AM6254BTGFHIALWRQ1?

4. Как быстро я получу предложение по AM6254BTGFHIALWRQ1?

5. Как скоро можно отправить AM6254BTGFHIALWRQ1?

6. Можете ли вы предложить альтернативы для AM6254BTGFHIALWRQ1?

Номер детали:

AM6254BTGFHIALWRQ1

Производитель:

Texas Instruments

AM6254BTGFHIALWRQ1 [Texas Instruments]

Номер детали:

AM6254BTGFHIALWRQ1

Категория:

Процессоры - специализированные приложения

Производитель:

Texas Instruments

Описание:

Automotive display SoC with embedded safety for digital clusters

Даташит:

Статус наличия:

Доступно для RFQ

Цена:

Запросить оптовую цену

Ответ на запрос:

В течение 24 часов

Доставка:

Товары в наличии отправляются в течение 1–2 рабочих дней

Спецификация

Детали продукта

Документы

Data sheet:

Errata:

User guide:

Application note:

Functional safety information:

White paper:

Application brief:

Особенности