PM8310A-FEI [Microchip]

The PM8310 TEMUX-336 is a high density T1/E1 framer, VT/TU mapper, and M13 multiplexer with integrated SONET/SDH framers for OC- 12/STM-4 and 4xOC-3/STM-1 applications. Feature integration and scalability make the TEMUX-336 ideal for use in ATCA/AMC line cards, voice and media gateways, routers, and multi-service and edge aggregation switches.

The TEMUX-336 device's unique Extended Serial SONET/SDH Interface (ESSI) enables:
• A low pin-count interconnect to additional TEMUX-336 devices for equipment protection applications
• Higher-rate SONET/SDH framers such as the PM5336 ARROW-2488 for channelized OC-48/STM-16 designs
• SONET/SDH cross-connects in transport applications
• Ethernet over SONET/SDH mappers such as the PM4390 ARROW M8xFE
• Additionally, the device's Scalable Bandwidth Interconnect (SBI) bus enables a simple interconnect to Microchip Layer 2 solutions such as the FREEDM (HDLC processor), S/UNI IMA (ATM inverse multiplexer) and AAL1gator (ATM-based CES processor) families.

Benefits
• Complete SONET/SDH front end with T1/E1, DS3/E3 ATCA/AMC space and power constraints
• Integrated SBI bus simplifies interconnection to layer 2 processors
• Meets timing requirements for wireless backhaul, critical for CESbased 336/252 T1/E1s across the SBI using the V4 byte
• Extended Serial SONET/SDH Interface (ESSI) can aggregate up to 4x protection in ACTA/AMC systems
• Supports linear 1+1 protection on the same device or to a companion TEMUX-336 device
• Enables a scalable architecture from T1/E1 up to OC-12/STM-4
• Supports T1/E1 mapping directly into SONET/SDH using VT1.5/TU-11 or VT2/TU-12 or multiplexed in DS3s using M13 or G.747
• Supports advanced test features including programmable pattern generation and detection for up to 64 byte sequences
• Fully integrated, monolithic IC ensures reliability

Applications
• ATCA/AMC-based line cards
• Voice and media gateways
• Wireless base station controllers (BSC) and radio network controllers (RNC)
• Routers and multi-service switches
• Edge aggregation switches
• Multi-service provisioning platforms

• 8 OC-3/STM-1 or 2 OC-12/STM-4 SONET/SDH framers (working and protection)
• 336 T1/252 E1 framers
• 12 M13 multiplexers, including support for G.747 multiplexing
• 12 DS3/E3 framers
• High order path processor for a SONET STS-12 or an SDH STM-4
• Tributary path processor for 336 VT1.5/TU-11s or 252 VT2/TU-12s
• Byte-synchronous and bit-asynchronous mapper for 336 VT1.5/TU-11s or 252 VT2/TU-12s
• Tributary path processor for 12 TU-3s
• Mapper for 12 DS3s or 12 E3s (TU-3 and AU-3)
• Up to 8 SONET/SDH Network interfaces (working and protection); 2 may operate at OC-12/STM-4 rates
• SONET/SDH Transport and Path overhead interfaces
• Two 622-Mbit/s Extended Serial SONET/SDH interfaces (ESSIs)
• Line side serial interface for up to 12 DS3s or E3s
• System-side 77.76 Scalable Bandwidth Interconnect (SBI336) bus for high-density interconnection of up to 336 T1 streams, 252 E1 streams, 12 DS3 streams, 12 E3 streams, or 12 arbitrary rate streams
• System-side serial interface for up to 12 DS3s or E3s
• Flexible bandwidth interface for up to 12 fractional rate links
• 32 Mbit/s synchronous TDM interface (based on H-MVIP)
• Microprocessor- and IEEE 1149.1-compliant JTAG interface
• 16-bit microprocessor interface
• Supports transparent virtual tributaries (TVT) where VT1.5/TU-11 and VT2/TU-12 payloads are transported intact between the line side and the SBI336 bus with pointer processing and low order path processing; TVT mode is configurable on a pertributary basis
• Provides optional jitter attenuation on the T1/E1 transmit and receive paths, and DS3/E3 transmit and receive paths including DS3/E3s demapped from SONET/SDH
• 896-pin FCBGA (31 x 31 mm)
• Supports industrial temperature range (-40 °C to 85 °C)