WP33C2D4NFEI-450B2 [Microchip]

This third generation of WinPath® products builds upon hundreds of successful customer communications system deployments and leverages the broad set of supplied protocols developed for WinPath1 and WinPath2. These protocols include support for L2 and L3 termination (including Ethernet, ML-PPP, IMA, CES), PWE3 (for Ethernet, TDM, HDLC, ATM), Packet Network Synchronization (IEEE 1588v2, Synchronous Ethernet, adaptive and differential clock recovery), interworking (MPLS, IPv4/IPv6 Routing, VLAN-aware bridging), OAM (for Ethernet and ATM), QoS (policing, shaping, per-flow queuing, WRED) and many others.

WinPath3 integrates control plane and enhanced data plane processing components. Control plane processing is based on two high performance MIPS 34K multi-threaded processors.

Data plane processing uses new hardware accelerators for packet classification, hierarchical shaping, additional security standards and more which have been added to off-load common processing tasks. These accelerators are flexibly combined with Microsemi's field-proven, fully-programmable, high performance, multi-threaded WinComm multi-core data path processor subsystem. The available number of cores in WinComm has increased from six to twelve along with increases in operating speed.

• 12 RISC processors and 64 concurrent hardware threads processing at up to 450 MHz
• Dual multi-threaded MIPS 34Kc® cores at 650MHz with L1 and L2 caches
• 3 level hierarchical shaper with 16K Flows with WRED accelerators
• 16x GbE and Two 10GbE MACs
• 14 multi-standard SERDES lanes
• 16 TDI supporting T1/E1/T3/E3 or CT/MVIP bus
• 2.5MB Internal memory; 3x 16-bit / 32-bit DDR3 interfaces
• 31mm x 31mm 896 FCBGA with 1mm ball pitch