LSM6DS3TR-C – STMicroelectronics iNEMO 6-Axis Accelerometer and Gyroscope IMU

Product Overview

The LSM6DS3TR-C is a 6-axis iNEMO inertial module manufactured by STMicroelectronics. It integrates a 3D digital accelerometer and a 3D digital gyroscope in a compact system-in-package, designed for always-on motion sensing, activity tracking, orientation detection, gesture recognition, IoT devices, wearables, smartphones, tablets, and embedded motion-control systems.

The device supports I²C and SPI digital interfaces, includes a 4KB FIFO for dynamic data batching, and provides low-power motion functions for efficient sensor operation. ST describes the LSM6DS3TR-C as a system-in-package featuring a 3D digital accelerometer and 3D digital gyroscope, operating at 0.90mA in high-performance mode and enabling always-on low-power features for consumer motion applications. 

The LSM6DS3TR-C also supports main operating-system sensor requirements, offering real, virtual, and batch sensors with 4KB FIFO for dynamic data batching. 

Part Number Breakdown

Competitive Advantages

✔ 6-axis IMU with 3D accelerometer + 3D gyroscope

✔ Accelerometer ranges: ±2g / ±4g / ±8g / ±16g

✔ Gyroscope ranges up to ±2000 dps

✔ I²C and SPI digital interfaces

✔ 4KB FIFO for dynamic data batching

✔ Low current: 0.90mA high-performance mode

✔ Supports real, virtual, and batch sensor requirements

✔ Compact 14-pin LGA/VFLGA package

✔ Suitable for wearables, smartphones, IoT devices, robotics, drones, and embedded motion sensing

Key Features

1. 6-Axis Motion Sensing

The LSM6DS3TR-C integrates both a 3-axis accelerometer and a 3-axis gyroscope.

Benefits:

• Measures linear acceleration and angular rate
• Enables motion, tilt, gesture, and orientation detection
• Reduces the need for separate accelerometer and gyro ICs
• Simplifies compact motion-sensing product design

2. Selectable Accelerometer Ranges

The accelerometer supports selectable full-scale ranges of ±2g, ±4g, ±8g, and ±16g.

Benefits:

• ±2g for tilt and low-motion sensing
• ±4g / ±8g for activity and handheld motion detection
• ±16g for impact, shock, and high-dynamic movement
• Software-configurable for different use cases

3. Selectable Gyroscope Ranges

The gyroscope supports selectable angular-rate ranges up to ±2000 dps.

Benefits:

• Supports slow orientation tracking and fast rotation sensing
• Useful for gaming, AR/VR, handheld controllers, and robotics
• Allows software tuning between sensitivity and dynamic range
• Suitable for consumer and embedded motion applications

4. I²C and SPI Digital Interfaces

The LSM6DS3TR-C provides standard I²C and SPI serial interfaces. ST’s application note describes the device as a 3D accelerometer and 3D gyroscope system-in-package with digital I²C/SPI serial interface output. 

Benefits:

• Easy integration with MCUs and SoCs
• I²C supports simple low-pin-count sensor networks
• SPI supports higher-speed sensor data transfer
• Reduces analog signal routing complexity

5. 4KB FIFO for Dynamic Data Batching

The LSM6DS3TR-C includes a 4KB FIFO, allowing sensor data to be stored before the host processor reads it. 

Benefits:

• Reduces host processor wakeups
• Helps lower total system power consumption
• Supports burst reads of motion data
• Useful for wearable and battery-powered devices

6. Low-Power Always-On Operation

ST highlights the device’s 0.90mA high-performance mode and always-on low-power feature support. 

Benefits:

• Suitable for battery-powered products
• Enables continuous motion monitoring
• Reduces standby energy consumption
• Supports always-on activity and gesture detection

7. Real, Virtual, and Batch Sensor Support

The LSM6DS3TR-C supports main operating-system sensor requirements, including real, virtual, and batch sensors. 

Benefits:

• Useful for smartphone and wearable sensor hubs
• Supports OS-level motion sensor frameworks
• Enables advanced motion and activity features
• Helps reduce host software complexity

8. Compact 14-Pin LGA Package

The device is supplied in a compact 14-pin LGA / VFLGA package, suitable for high-density PCB designs. 

Benefits:

• Small PCB footprint
• Suitable for wearables and compact IoT modules
• Compatible with automated SMT assembly
• Good fit for consumer and embedded sensor designs

Applications

Wearables and Fitness Devices

• Smart watches
• Fitness trackers
• Activity monitors
• Smart bands
• Portable health devices

Smartphones and Tablets

• Screen orientation detection
• Gesture recognition
• Motion-based user interfaces
• Gaming motion input
• Sensor hub applications

IoT and Smart Devices

• Smart home sensors
• Battery-powered motion nodes
• Wake-on-motion systems
• Asset movement detection
• Connected consumer devices

Robotics and Drones

• Motion feedback
• Orientation sensing
• Stabilization systems
• Tilt and rotation detection
• Sensor fusion platforms

Industrial and Embedded Systems

• Vibration monitoring
• Equipment motion detection
• Handheld instruments
• Tilt detection
• Human-machine interface devices