CC2564BYFVR [Texas Instruments]

Name: CC2564BYFVR
Brand: Texas Instruments
SKU: CC2564BYFVR
Availability: InStock

Part No:

CC2564BYFVR

Wireless & RF Integrated Circuits

Manufacturer:

Texas Instruments

Description:

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market.

Stock Status:

Available for RFQ

Pricing:

Request Volume Pricing

Quote Response:

Within 24 Hours

Shipping:

In-stock parts ship in 1–2 business days

Specification

Type

Parameter

Package

mrQFN-76, 0.6-mm Pitch, 8.10-mm x 8.10-mm

Supply Voltage Io

1.8V

Tx Power Max

+12 dBm

Products Detail

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that supports Bluetooth 4.0 dual-mode (BR/EDR/LE) protocols. When coupled with a microcontroller unit (MCU), the HCI device provides best-in-class RF performance. TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation. With transmit power and receive sensitivity, this solution provides a best-in-class range of about 2x, compared to other BLE-only solutions. A royalty-free software Bluetooth stack available from TI is pre-integrated with TI's MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs.

Key Features

Single-Chip Bluetooth Solution Integrating Bluetooth Basic Rate (BR)/Enhanced Data Rate (EDR)/Low Energy (LE) Features Fully Compliant With the Bluetooth 4.0 Specification Up to the HCI Layer
BR/EDR Features: Up to 7 Active Devices, Scatternet: Up to 3 Piconets Simultaneously, Up to 2 SCO Links on the Same Piconet
LE Features: Support of Up to 10 Simultaneous Connections, Multiple Sniff Instances, Independent Buffering for LE
Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
Class 1.5 TX Power Up to +12 dBm
Internal Temperature Detection and Compensation
Improved Adaptive Frequency Hopping (AFH) Algorithm
Provides Longer Range, Including 2x Range Over Other BLE-Only Solutions
ROM Spin to Enable Offload Host and Save Current With Assisted Audio (SBC Encode and Decode On Chip)
Advanced Power Management: On-Chip Power Management, Low Power Consumption for Active, Standby, and Scan Bluetooth Modes, Shutdown and Sleep Modes
Physical Interface: Fully Programmable Digital PCM-I2S Codec and Interface
Device Pin-to-Pin Compatible With Previous Devices or Modules
Highly Optimized for Low-Cost Designs: Single-Ended 50-Ω RF Interface

Application scenarios

Mobile phone accessories
Remote controls
Sports and fitness applications
Toys
Wireless audio solutions

Product FAQ

1. Is CC2564BYFVR available for RFQ?

Yes. CC2564BYFVR by Texas Instruments is available for RFQ. Submit your required quantity and our team will confirm real-time stock, lead time, and volume pricing.

2. Why is there no fixed price for CC2564BYFVR?

Pricing for CC2564BYFVR can vary by order quantity, market availability, date code, packaging, and delivery destination. Request a quote to receive the latest volume pricing.

3. What are the key specifications of CC2564BYFVR?

CC2564BYFVR is a Texas Instruments Wireless & RF Integrated Circuits with Supply Voltage Io: 1.8V and Tx Power Max: +12 dBm. Review the product details or submit an RFQ if you need confirmation before purchase.

4. How fast can I get a quote for CC2564BYFVR?

Our sales team usually responds within 24 hours after receiving your RFQ. The quote may include stock status, unit price, lead time, shipping options, and available alternatives.

5. How soon can CC2564BYFVR be shipped?

If stock is confirmed, in-stock parts can usually ship within 1–2 business days. Final lead time depends on quantity, stock source, and delivery destination.

6. Can you suggest alternatives to CC2564BYFVR?

Yes. If CC2564BYFVR is unavailable, obsolete, or does not meet your required lead time, we can help check similar Texas Instruments Wireless & RF Integrated Circuits parts or compatible alternatives.

RFQ

Part Number:

CC2564BYFVR

Manufacturer:

Texas Instruments

Looking for Pricing? Contact us for volume pricing.

Shipping & Warranty

Fast Dispatch: Ships in 5-7 days(in-stock parts within 1-2 days)

Unishop Global Export: 1-7 days, $40.00

Guaranteed Delivery: Door-to-door in 30 days

Compliant Worldwide Shipping: DHL, FedEx, SF, and UPS.

Feature

30-Day Guarantee
Fasted Delivery
Hassle-Free Returns
Secure payment method

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Single-Chip Bluetooth Solution Integrating Bluetooth Basic Rate (BR)/Enhanced Data Rate (EDR)/Low Energy (LE) Features Fully Compliant With the Bluetooth 4.0 Specification Up to the HCI Layer
BR/EDR Features: Up to 7 Active Devices, Scatternet: Up to 3 Piconets Simultaneously, Up to 2 SCO Links on the Same Piconet
LE Features: Support of Up to 10 Simultaneous Connections, Multiple Sniff Instances, Independent Buffering for LE
Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
Class 1.5 TX Power Up to +12 dBm
Internal Temperature Detection and Compensation
Improved Adaptive Frequency Hopping (AFH) Algorithm
Provides Longer Range, Including 2x Range Over Other BLE-Only Solutions
ROM Spin to Enable Offload Host and Save Current With Assisted Audio (SBC Encode and Decode On Chip)
Advanced Power Management: On-Chip Power Management, Low Power Consumption for Active, Standby, and Scan Bluetooth Modes, Shutdown and Sleep Modes
Physical Interface: Fully Programmable Digital PCM-I2S Codec and Interface
Device Pin-to-Pin Compatible With Previous Devices or Modules
Highly Optimized for Low-Cost Designs: Single-Ended 50-Ω RF Interface