Henkel Adhesive Electronics is a division of Henkel Corporation, the world's leading material innovation company. In the fields of industrial, consumer, handheld devices, wearable devices, displays and emerging electronics markets, we focus on the development of next-generation materials for various applications in these fields. As Henkel's leading electronic brands, LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist, they have long been recognized as product brands for printed circuit board assembly applications and are worthy of your trust. We offer a wide range of material combinations. We not only have surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials, but also have CSP underfills and board protection materials. Henkel's advanced formula is the guarantee of maximum processability and reliable field performance.
LOCTITE-High quality, reliability and performance are synonymous with the LOCTITE brand. In the electronics field, LOCTITE, as the main brand, provides product lines including Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating.
Bergquist-now a part of Henkel. In a variety of challenging applications, Bergquist thermal management material series can provide excellent thermal control. Henkel is known for outstanding well-known brands such as Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form® and Bond-Ply®. The solution to achieve effective thermal management from the substrate level through to the final assembly is their thermal material product portfolio.
Multicore-Multicore is now sold on the market as LOCTITE. LOCTITE solder products have successfully become one of the most trusted and recommended interconnect materials in the industry. After decades of innovative development of solder formulations, not only has LOCTITE solder materials won numerous industry awards, but also the electronics market has begun to shift to lead-free, halogen-free, and highly reliable soldering processes. Game-changing formulas such as LOCTITE GC 10 and LOCTITE GC 3W solder paste are characterized by temperature stability. These formulas can reduce costs, increase yield, and provide a more stable and reliable assembly process. Advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire are all LOCTITE's high-quality solder product series.
