LSM6DSV320XTR [STMicroelectronics]

The LSM6DSV320X is a high-end, low-noise, low-power, small IMU, featuring a 3-axis digital low-g accelerometer at 16 g, a 3-axis digital high-g accelerometer at 320 g, and a 3-axis digital gyroscope, which offers the best IMU sensor with an architecture for processing acceleration and angular rate data on four separate channels (user interface, OIS, EIS, and high-g accelerometer data). This IMU enables a new range of applications targeting emergency calls, fall/drop reconstruction, intense movement tracking, concussion monitoring, and so forth.

The device enables edge AI computing, leveraging a finite state machine (FSM) for configurable motion tracking and a machine learning core (MLC) for context awareness with exportable AI features for personal electronics and IoT applications.

The LSM6DSV320X features adaptive self-configuration (ASC) to optimize power consumption. The sensor can automatically adjust its settings in real time upon detecting a specific motion pattern or signal from the MLC, without intervention from the host processor. The digital circuitry also includes ST’s sensor fusion low-power (SFLP) technology for spatial orientation.

The device embeds a dedicated accelerometer sensor with an independent channel and filtering for high-g acceleration detection that perfectly matches shock requirements for sports, concussion detection, shock detection, and a full range of car crash detection applications.

• Quad-channel architecture for UI, EIS, OIS, and high-g data processing
• Smart, always-aware experience for system power optimization
• Dual accelerometer channels
  • Low-g channel ±2/±4/±8/±16 g full scale
  • High-g channel ±32/±64/±128/±256/±320 g full scale
• Gyroscope full scale: ±250/±500/±1000/±2000/±4000 dps
• SPI / I²C & MIPI I3C^® v1.1 serial interface with main processor data synchronization
• Auxiliary SPI & MIPI I3C^® v1.1 for OIS data output for gyroscope and accelerometer
• Programmable finite state machine for accelerometer (high-g & low-g), gyroscope, and external sensor data processing with high rate @ 960 Hz
• Machine learning core with exportable features and filters for AI applications
• Embedded adaptive self-configuration (ASC)
• Embedded sensor fusion low-power (SFLP) algorithm
• OIS configurable from the auxiliary or primary interface
• EIS dedicated channel on primary interface with dedicated filtering
• Advanced pedometer, step detector, and step counter
• Significant motion detection, tilt detection
• Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click, high-g wake-up and high-g shock
• Smart FIFO up to 4.5 KB
• Embedded temperature sensor
• Independent I/O supply
  • I²C voltage range: 1.62 V to 3.6 V
  • SPI / MIPI I3C^® extended voltage range: 1.08 V to 3.6 V
• Supply current
  • 6-axis configuration @ 0.67 mA in combo high-performance mode
  • 9-axis configuration @ 0.80 mA in combo high-performance mode
• Compact footprint: 2.5 mm x 3 mm x 0.83 mm
• ECOPACK and RoHS compliant