The X-NUCLEO-IKS4A1 is a motion MEMS and environmental sensor evaluation board kit consisting of the main board X-NUCLEO-IQS4A1, which hosts the motion MEMS and environmental sensors, and the detachable add-on board STEVAL-MKE001A, which hosts the Qvar swipe electrodes.

This expansion board allows application development with features like sensor HUB (LSM6DSO16IS and LSM6DSV16X), electronic image stabilization (EIS) and optical image stabilization (OIS) for camera applications through LSM6DSV16X SPI interface and Qvar touch/swipe gestures (thanks to the equipped electrode).

There is also the possibility to integrate presence and motion detection with an IR sensor as well as combining the features of multiple sensors through the DIL24 adapter.

• Wide range of motion and environmental sensors:
  • LSM6DSO16IS: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000 dps) with ISPU (Intelligent Processing Unit)
  • LIS2MDL: MEMS 3D magnetometer (±50 gauss)
  • LIS2DUXS12: Ultra low-power MEMS 3D accelerometer (±2/±4/±8/±16 g) with Qvar, AI, & anti-aliasing
  • LPS22DF: Low-power and high-precision MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
  • SHT40AD1B: High-accuracy, ultra-low-power relative humidity and temperature sensor (by Sensirion)
  • STTS22H: Low-voltage, ultralow-power, 0.5 °C accuracy temperature sensor (–40 °C to +125 °C)
  • LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar
• LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar
• DIL 24-pin socket available for additional MEMS adapters and other sensors
• Compatible with X-CUBE-MEMS1, an expansion software package for STM32Cube
• Equipped with Qvar touch/swipe electrode
• I²C sensor hub features on LSM6DSO16IS and LSM6DSV16X available
• Supported by MEMS-Studio, a software solution for MEMS sensors with graphical no-code design of algorithms and development of embedded AI features
• MIPI I3C® compatibility for communication with LIS2DUXS12, LSM6DSV16X and LPS22DF
• Compatible with STM32 Nucleo boards
• Equipped with Arduino UNO R3 connector
• Equipped with industrial connector for IR sensor (STHS34PF80) application development. It can be connected at the same time of external MEMS through DIL24 adapter
• Available interface for external camera module applications coupled with LSM6DSV16X through aux SPI (3/4 w)
• RoHS compliant
• WEEE compliant
• UKCA compliant